Grinding EFEM load/unload port equipment
Functions and Features
- Compatible with 8”/12” wafer sizes
- The fork can be configured to flip or transfer wafers and substrates using vacuum suction or negative pressure, according to user requirements
- 晶圓手臂搭配橫向電動滑台軸，可以配置二組load port上下料傳送（可針對需求客製）
- 具備Pre Aligner unit / clean unit / bubble clean unit/ roller brush clean unit 對應製程需求
- 通訊方式:RS232以及I/O控制通訊
- 對應SCES/GEM規範，具備系統交握參數收集功能
- User-friendly human-machine interface for easy and intuitive operation
- 可依據不同製程需求進行規劃設計，對應各式晶圓的傳送搬移
- 可針對需求客製(loadport/上拋系統/生產履歷管理)
Specification
- Size: 2700*2120*2400mm
- Weight: 1245 kg
- Passline：1050±50mm
- Electricity requirements: 220V 3PH 30A
- Repeated accuracy: ±0.03mm
Practical applicable industry
- Semiconductor Industry
INNOTEK APPLIED INDUSTRY CO.LTD
No. 187, Sec. 1, Gong 2nd Rd., Longtan Dist., Taoyuan City 325 , Taiwan (R.O.C.)
TEL : +886 3 2755528
FAX: +886 3 2755529
service@innotek-applied.com
FAX: +886 3 2755529
service@innotek-applied.com