Grinding EFEM Load/unload Port Equipment

Functions and Features

  • Compatible with 8”/12” wafer sizes
  • The fork can be configured to flip or transfer wafers and substrates using vacuum suction or negative pressure, according to user requirements
  • The wafer-handling arm is equipped with a horizontal motorized slide axis and can be configured with two load ports for loading and unloading (customizable based on requirements)
  • Supports a pre aligner unit, clean unit, bubble clean unit, and roller brush clean unit to meet various process requirements
  • Communication Interface: RS232 and I/O control communication
  • Complies with SECS/GEM standards and includes system-handshake and parameter-collection functions
  • User-friendly human-machine interface for easy and intuitive operation
  • Configurable according to different process requirements to support various wafer-transfer workflows
  • Load port, wafer-tossing system, production-history management, and other functions can be tailored as needed

Specification

  • Size: 2700*2120*2400mm
  • Weight: 1245 kg
  • Passline: 1050±50mm
  • Electricity requirements: 220V 3PH 30A
  • Repeated accuracy: ±0.03mm

Practical applicable industry

  • Semiconductor Industry

INNOTEK APPLIED INDUSTRY CO., LTD.

No. 187, Sec. 1, Gong 2nd Rd., Longtan Dist., Taoyuan City 325 , Taiwan (R.O.C.)

TEL : +886 3 2755528
FAX: +886 3 2755529
service@innotek-applied.com