Grinding EFEM Load/unload Port Equipment


Functions and Features
- Compatible with 8”/12” wafer sizes
- The fork can be configured to flip or transfer wafers and substrates using vacuum suction or negative pressure, according to user requirements
- The wafer-handling arm is equipped with a horizontal motorized slide axis and can be configured with two load ports for loading and unloading (customizable based on requirements)
- Supports a pre aligner unit, clean unit, bubble clean unit, and roller brush clean unit to meet various process requirements
- Communication Interface: RS232 and I/O control communication
- Complies with SECS/GEM standards and includes system-handshake and parameter-collection functions
- User-friendly human-machine interface for easy and intuitive operation
- Configurable according to different process requirements to support various wafer-transfer workflows
- Load port, wafer-tossing system, production-history management, and other functions can be tailored as needed
Specification
- Size: 2700*2120*2400mm
- Weight: 1245 kg
- Passline: 1050±50mm
- Electricity requirements: 220V 3PH 30A
- Repeated accuracy: ±0.03mm
Practical applicable industry
- Semiconductor Industry
INNOTEK APPLIED INDUSTRY CO., LTD.
No. 187, Sec. 1, Gong 2nd Rd., Longtan Dist., Taoyuan City 325 , Taiwan (R.O.C.)
TEL : +886 3 2755528
FAX: +886 3 2755529
service@innotek-applied.com
FAX: +886 3 2755529
service@innotek-applied.com
